Wafer bonding technology and its optoelectronic applications

Yu-Hwa Lo; Zuhua Zhu; Yi Qian; Felix Ejike Ejeckam; Gina L. Christenson

doi:10.1117/12.264243

22 January 1997 Wafer bonding technology and its optoelectronic applications

Yu-Hwa Lo, Zuhua Zhu, Yi Qian, Felix Ejike Ejeckam, Gina L. Christenson

Proceedings Volume 3006, Optoelectronic Integrated Circuits; (1997) https://doi.org/10.1117/12.264243
Event: Photonics West '97, 1997, San Jose, CA, United States

Abstract

This paper describes the wafer bonding technology and its applications to optoelectronic devices and circuits. It shows that the wafer bonding technology can create new device structures with unique characteristics and can form integrated optoelectronic circuits containing optical, electronic and micro-mechanical devices.

Citation Download Citation

Yu-Hwa Lo, Zuhua Zhu, Yi Qian, Felix Ejike Ejeckam, and Gina L. Christenson "Wafer bonding technology and its optoelectronic applications", Proc. SPIE 3006, Optoelectronic Integrated Circuits, (22 January 1997); https://doi.org/10.1117/12.264243

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