Wafer bonding technology and its applications in optoelectronic devices

Zuhua Zhu; Guilan Ding; Kangsheng Chen; Felix Ejike Ejeckam; Yi Qian; Gina L. Christenson; Yu-Hwa Lo

doi:10.1117/12.253172

30 September 1996 Wafer bonding technology and its applications in optoelectronic devices

Zuhua Zhu, Guilan Ding, Kangsheng Chen, Felix Ejike Ejeckam, Yi Qian, Gina L. Christenson, Yu-Hwa Lo

Proceedings Volume 2891, Integrated Optoelectronics; (1996) https://doi.org/10.1117/12.253172
Event: Photonics China '96, 1996, Beijing, China

Abstract

The new optoelectronic integrated technology--wafer bonding is described. The results of wafer bonding and applications in several new types of optoelectronic devices are presented.

Citation Download Citation

Zuhua Zhu, Guilan Ding, Kangsheng Chen, Felix Ejike Ejeckam, Yi Qian, Gina L. Christenson, and Yu-Hwa Lo "Wafer bonding technology and its applications in optoelectronic devices", Proc. SPIE 2891, Integrated Optoelectronics, (30 September 1996); https://doi.org/10.1117/12.253172

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