Bake mechanisms in novolak-based photoresist films: investigation by contact angle measurements

Emilienne Fadda; C. Clarisse; Patrick Jean Paniez

doi:10.1117/12.241844

14 June 1996 Bake mechanisms in novolak-based photoresist films: investigation by contact angle measurements

Emilienne Fadda, C. Clarisse, Patrick Jean Paniez

Proceedings Volume 2724, Advances in Resist Technology and Processing XIII; (1996) https://doi.org/10.1117/12.241844
Event: SPIE's 1996 International Symposium on Microlithography, 1996, Santa Clara, CA, United States

Abstract

Bakes are important steps in lithographic processes. In this work, bake mechanisms are studied using the contact angle measurement (CAM) technique on pure novolak spin-coated films. Both the dispersive and basic components of the surface energy are measured at room temperature on samples previously processed at different bake temperatures, by additional bake steps of 20 degrees Celsius, starting from room temperature up to 200 degrees Celsius. The importance of two main parameters, namely the glass transition temperature (Tg) of the polymer and the hydrogen-bonding tendency of the casting solvent is emphasized in the description of the evaporation mechanisms of residual solvent molecules.

Citation Download Citation

Emilienne Fadda, C. Clarisse, and Patrick Jean Paniez "Bake mechanisms in novolak-based photoresist films: investigation by contact angle measurements", Proc. SPIE 2724, Advances in Resist Technology and Processing XIII, (14 June 1996); https://doi.org/10.1117/12.241844

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