Paper
1 June 1992 Planarization of spin-coated films
Loni M. Peurrung, David B. Graves
Author Affiliations +
Abstract
To measure film thickness profiles over substrates with surface topography in situ during spin coating, we use a pulsed laser, a microscope, and a 35-mm camera to stroboscopically create and image interference fringes. The measured film thickness profiles are compared to predictions from a model of the coating flow which accounts for centrifugal, capillary, and viscous forces. This model has been extended to include both radial and azimuthal variations so that the surface contours around fully three-dimensional features may be calculated. Profile asymmetry in the radial direction, known as "pile-up", is caused by surface tension forces near the edges of the feature that accelerate flow where the channel (the film thickness) narrows and retard flow where the film thickness widens.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Loni M. Peurrung and David B. Graves "Planarization of spin-coated films", Proc. SPIE 1674, Optical/Laser Microlithography V, (1 June 1992); https://doi.org/10.1117/12.130353
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Semiconducting wafers

Coating

3D modeling

Capillaries

Interferometry

Microfluidics

Optical lithography

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