High throughput, angstrom-level metrology for copper-copper hybrid bonding

Arseniy Kalinin; Niranjan Saikumar; Irene Battisti; Erik Simons; Seokhan Kim; ShihWei Yu; Hokyun Chin; Artem Khachaturiants; Cong Chen; Bensu Tunca Altintas; Soon Aik Chew; Boyao Zhang; Nelda Antonovaité; Rudolf Wilhelm; Alain Moussa; Janusz Bogdanowicz; Anne-Laure Charley; Hamed Sadeghian

doi:10.1117/12.3010482

10 April 2024 High throughput, angstrom-level metrology for copper-copper hybrid bonding

Arseniy Kalinin, Niranjan Saikumar, Irene Battisti, Erik Simons, Seokhan Kim, ShihWei Yu, Hokyun Chin, Artem Khachaturiants, Cong Chen, Bensu Tunca Altintas, Soon Aik Chew, Boyao Zhang, Nelda Antonovaité, Rudolf Wilhelm, Alain Moussa, Janusz Bogdanowicz, Anne-Laure Charley, Hamed Sadeghian

Author Affiliations +

Proceedings Volume 12955, Metrology, Inspection, and Process Control XXXVIII; 129552T (2024) https://doi.org/10.1117/12.3010482
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Conference Poster

Abstract

Pitch scaling of interconnects is required for 3D system integration with the industry shifting to bumpless bonding technology. However, hybrid metal/dielectric bonding requires tight process control of planarity after chemical mechanical polishing (CMP) to avoid bonding voids. Due to its sub-angstrom resolution, atomic force microscopy (AFM) is typically used to assess the nano-topography but conventional systems suffer from increased noise floor at high scanning speeds making it unsuitable for high-volume manufacturing (HVM). Here, we validate a novel in-line high-throughput AFM system (QUADRA) by reporting the topographical parameters of 250 nm and 1 μm size copper nano-pads at high scanning speeds that reach tens of wafers per hour throughput.

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Arseniy Kalinin, Niranjan Saikumar, Irene Battisti, Erik Simons, Seokhan Kim, ShihWei Yu, Hokyun Chin, Artem Khachaturiants, Cong Chen, Bensu Tunca Altintas, Soon Aik Chew, Boyao Zhang, Nelda Antonovaité, Rudolf Wilhelm, Alain Moussa, Janusz Bogdanowicz, Anne-Laure Charley, and Hamed Sadeghian "High throughput, angstrom-level metrology for copper-copper hybrid bonding", Proc. SPIE 12955, Metrology, Inspection, and Process Control XXXVIII, 129552T (10 April 2024); https://doi.org/10.1117/12.3010482

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