Mr. Rudolf Wilhelm Profile

Rudolf Wilhelm

at Nearfield Instruments

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Author

Publications (3)

Proceedings Article | 10 April 2024 Poster

Validation of high-throughput AFM for copper pad metrology in high volume manufacturing

Kyung Souk Yi, Min Hong, Jiyeon Kim, Eunpa Kim, Kwang Soo Kim, Kyong Wook Noh, Su-Young Lee, Myungjun Lee, Yusin Yang, Hokyun Chin, Arseniy Kalinin, Irene Battisti, Erik Simons, Seokhan Kim, ShihWei Yu, Nelda Antonovaité, Niranjan Saikumar, Rudolf Wilhelm, Hamed Sadeghian

Proceedings Volume 12955, 129552U (2024) https://doi.org/10.1117/12.3010488

KEYWORDS: Semiconducting wafers, High volume manufacturing, Metrology, Copper, Chemical mechanical planarization, Surface finishing, Semiconductor manufacturing, Process control, Miniaturization, Atomic force microscopy

Proceedings Article | 10 April 2024 Poster

Validation of non-destructive 3D probe-based metrology for EUV lithography

Nelda Antonovaité, ShihWei Yu, Khalid Elsayed, Erik Simons, Hokyun Chin, Arseniy Kalinin, Irene Battisti, Helda Pahlavani, Seokhan Kim, Artem Khachaturiants, Niranjan Saikumar, Rudolf Wilhelm, Hamed Sadeghian

Proceedings Volume 12955, 1295531 (2024) https://doi.org/10.1117/12.3010719

KEYWORDS: Extreme ultraviolet lithography, Metrology, 3D metrology, Nondestructive evaluation, Line width roughness, Atomic force microscopy, Surface roughness, Photoresist materials, Line edge roughness, Algorithm development

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Proceedings Article | 10 April 2024 Poster

High throughput, angstrom-level metrology for copper-copper hybrid bonding

Arseniy Kalinin, Niranjan Saikumar, Irene Battisti, Erik Simons, Seokhan Kim, ShihWei Yu, Hokyun Chin, Artem Khachaturiants, Cong Chen, Bensu Tunca Altintas, Soon Aik Chew, Boyao Zhang, Nelda Antonovaité, Rudolf Wilhelm, Alain Moussa, Janusz Bogdanowicz, Anne-Laure Charley, Hamed Sadeghian

Proceedings Volume 12955, 129552T (2024) https://doi.org/10.1117/12.3010482

KEYWORDS: Metrology, Semiconducting wafers, Copper, Chemical mechanical planarization, Surface roughness, High volume manufacturing, Atomic force microscopy, Wafer bonding, Wafer testing, System integration

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