Design considerations for high etch resistance spin-on carbon underlayers

Li Cui; Iou-Sheng Ke; Anton Chavez; Keren Zhang; Paul LaBeaume; Suzanne Coley; Shintaro Yamada; Jim Cameron; Lei Zhang; William Marshall; Benjamin Foltz

doi:10.1117/12.2552024

23 March 2020 Design considerations for high etch resistance spin-on carbon underlayers

Li Cui, Iou-Sheng Ke, Anton Chavez, Keren Zhang, Paul LaBeaume, Suzanne Coley, Shintaro Yamada, Jim Cameron, Lei Zhang, William Marshall, Benjamin Foltz

Author Affiliations +

Proceedings Volume 11326, Advances in Patterning Materials and Processes XXXVII; 113261N (2020) https://doi.org/10.1117/12.2552024
Event: SPIE Advanced Lithography, 2020, San Jose, California, United States

Abstract

As the critical dimension (CD) in semiconductor devices continues to shrink, the multilayer patterning process to transfer fine line patterns into an underlying substrate is becoming increasingly important. The trilayer processes consist of a photoresist film, a silicon-containing layer and a carbon rich underlayer. The distinctive difference in etch selectivity toward fluorine and oxygen based reactive ion etching (RIE) chemistry is critical to provide highly selective pattern transfer to the substrate. In response to the need for high etch resistant underlayers, we have developed carbon rich spin-on carbon (SOC) materials with good solubility in preferred casting solvents, high thermal stability and high dry etch resistance. To better understand structure-property relationships of high etch resistant SOC films, cured SOC films were analyzed by Fourier-transform infrared spectroscopy (FT-IR), ultraviolet-visible spectroscopy (UV-Vis), X-ray reflectivity (XRR), X-ray photoelectron spectroscopy (XPS) and X-ray absorption spectroscopy (XAS). The design considerations for high etch resistance SOC underlayers, such as Ohnishi parameter, crosslinking and film density, will be discussed in this paper.

Citation Download Citation

Li Cui, Iou-Sheng Ke, Anton Chavez, Keren Zhang, Paul LaBeaume, Suzanne Coley, Shintaro Yamada, Jim Cameron, Lei Zhang, William Marshall, and Benjamin Foltz "Design considerations for high etch resistance spin-on carbon underlayers", Proc. SPIE 11326, Advances in Patterning Materials and Processes XXXVII, 113261N (23 March 2020); https://doi.org/10.1117/12.2552024

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
12 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

System on a chip

Polymers

Etching

Resistance

Carbon

Polymer thin films

X-rays

Show All Keywords

Keywords/Phrases

Search In:

Publication Years