Paper
1 January 1988 A Stepper Image Monitor For Precise Setup And Characterization
T. A. Brunner, S. Cheng, A. E. Norton
Author Affiliations +
Abstract
The Stepper Image Monitor(SIM) system tests the resolution and overlay performance of complete stepper systems by measuring the aerial image intensity profile at many wafer locations and focus offsets. Overlay error vectors can be measured with a precision of .02μm and best focus can be determined to a precision of O.lμm without exposing test wafers. New data will be presented on lens heating effects, along with a simple model. Imagery of high NA steppers will be explored by observing image profiles of various sub-micron lines. A new poly-on-oxide process to fabricate permanent SIM reference wafers will be described. This paper will describe other recent developments which have made SIM techniques broadly applicable to many practical problems of stepper setup and characterization.
© (1988) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
T. A. Brunner, S. Cheng, and A. E. Norton "A Stepper Image Monitor For Precise Setup And Characterization", Proc. SPIE 0922, Optical/Laser Microlithography, (1 January 1988); https://doi.org/10.1117/12.968434
Lens.org Logo
CITATIONS
Cited by 8 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Semiconducting wafers

Reticles

Signal detection

Light scattering

Sensors

Optical lithography

Image quality

RELATED CONTENT

Practical 0.35-um i-line lithography
Proceedings of SPIE (May 17 1994)
New 5X i-Line Projection Aligner For VLSI Fabrication
Proceedings of SPIE (January 01 1988)
Improvements in 0.5-micron production wafer steppers
Proceedings of SPIE (July 01 1991)
Reticle Contamination Monitor For A Wafer Stepper
Proceedings of SPIE (June 29 1984)
Applications Of The Square Count Yield Model
Proceedings of SPIE (June 29 1984)

Back to Top