Mid-UV Photoresists Combining Chemical Amplification And Dissolution Inhibition

Michael J. O'Brien; James V. Crivello

doi:10.1117/12.968300

1 January 1988 Mid-UV Photoresists Combining Chemical Amplification And Dissolution Inhibition

Michael J. O'Brien, James V. Crivello

Proceedings Volume 0920, Advances in Resist Technology and Processing V; (1988) https://doi.org/10.1117/12.968300
Event: Santa Clara Symposium on Microlithography, 1988, Santa Clara, CA, United States

Abstract

This paper describes the development of mid-UV photoresist materials based on the combined principles of chemical amplification and dissolution inhibition. These resists are composed of a novolac resin, a dissolution inhibitor containing an acid labile blocking group, and a photosensitive onium salt. A positive image is obtained by exposure to mid-UV irradiation, which generates a strong Bronsted acid from the onium salt, heating the resist so that the acid can catalyze deblocking of the acid labile groups on the dissolution inhibitor, and finally development with aqueous base. Interestingly, this system works well despite the fact that novolacs have previously been shown to become insolubilized by heating them in the presence of onium salt photoproducts.

Citation Download Citation

Michael J. O'Brien and James V. Crivello "Mid-UV Photoresists Combining Chemical Amplification And Dissolution Inhibition", Proc. SPIE 0920, Advances in Resist Technology and Processing V, (1 January 1988); https://doi.org/10.1117/12.968300

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