High Resolution Positive E-Beam Resist With Dry Etch Durability

Akira Akimoto; Toru Seita; Yoshitaka Tsutsumi

doi:10.1117/12.940332

25 August 1987 High Resolution Positive E-Beam Resist With Dry Etch Durability

Akira Akimoto, Toru Seita, Yoshitaka Tsutsumi

Proceedings Volume 0771, Advances in Resist Technology and Processing IV; (1987) https://doi.org/10.1117/12.940332
Event: Microlithography Conferences, 1987, Santa Clara, CA, United States

Abstract

Electron beam exposure characteristics,such as sensitivity and contrast,and durability against oxygen plasma were measured with poly(1-pheny1-2.2.2-trifluoroethyl-α-chloro-acrylate) PCLTF prepared by solution free radical polymerization. New developers were examined for this type of polymer. Using mixtures of diisobutyl ketone DIBK and isopropyl alcohol IPA (35:65),PCLTF was preciously imaged at 25pc/cm2(0.5μm lines and spaces). Moreover with use of suitable mixture of diisopropyl ketone DIPK and isopropyl alcohol (35:65),the image at 8pc/cm2(1μm lines & spaces) is also possible. PCLTF was 1.5 times the high dry etching durability of PMMA against oxygen plasma,and showed considerably high contrast and fine gaps as narrow as 0.2μm.

Citation Download Citation

Akira Akimoto, Toru Seita, and Yoshitaka Tsutsumi "High Resolution Positive E-Beam Resist With Dry Etch Durability", Proc. SPIE 0771, Advances in Resist Technology and Processing IV, (25 August 1987); https://doi.org/10.1117/12.940332

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