Dr. Viorel Dragoi Profile

Dr. Viorel Dragoi

Chief Scientist Permanent Wafer Bonding at EV Group GmbH

SPIE Involvement:

Author

Proceedings Article | 14 June 2017 Paper

Innovative metal thermo-compression wafer bonding for microelectronics and MEMS devices

B. Rebhan, V. Dragoi

Proceedings Volume 10246, 102461H (2017) https://doi.org/10.1117/12.2266492

KEYWORDS: Metals, Wafer bonding, Microelectromechanical systems, Liquids, Microelectronics, Solids, Interfaces, Light emitting diodes, Mirrors, Semiconducting wafers, Copper, Diffusion, Tin, Annealing

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Proceedings Article | 21 May 2015 Paper

Wafer bonding technology for new generation vacuum MEMS: challenges and promises

V. Dragoi, E. Pabo

Proceedings Volume 9517, 951708 (2015) https://doi.org/10.1117/12.2178920

KEYWORDS: Wafer bonding, Microelectromechanical systems, Semiconducting wafers, Glasses, Metals, Annealing, Manufacturing, Silicon, Gold, Sensors

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Proceedings Article | 17 May 2013 Paper

Control of cavitation density through gas and acoustic uniformity in a proximity megasonic pre-bond cleaning system

D. Dussault, E. Liebscher, F. Fournell, V. Dragoi

Proceedings Volume 8763, 87632Y (2013) https://doi.org/10.1117/12.2018006

KEYWORDS: Particles, Semiconducting wafers, Transducers, Wafer bonding, Acoustics, Cavitation, Process control, Wafer testing, Control systems, Surface finishing

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Proceedings Article | 17 May 2013 Paper

Cu-Sn transient liquid phase wafer bonding for MEMS applications

C. Flötgen, M. Pawlak, E. Pabo, H. J. van de Wiel, G. R. Hayes, V. Dragoi

Proceedings Volume 8763, 87630A (2013) https://doi.org/10.1117/12.2017350

KEYWORDS: Copper, Semiconducting wafers, Tin, Metals, Wafer bonding, Interfaces, Deposition processes, Scanning electron microscopy, Liquids, Microelectromechanical systems

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Proceedings Article | 5 May 2011 Paper

Wafer bonding for MEMS and CMOS integration

V. Dragoi, E. Pabo, J. Burggraf, G. Mittendorfer

Proceedings Volume 8066, 806622 (2011) https://doi.org/10.1117/12.886699

KEYWORDS: Wafer bonding, Semiconducting wafers, Metals, Microelectromechanical systems, Adhesives, Contamination, Annealing, Interfaces, Oxides, Manufacturing

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Proceedings Article | 19 May 2009 Paper

Adhesive wafer bonding using photosensitive polymer layers

Viorel Dragoi, Erkan Cakmak, Elliott Capsuto, Craig McEwen, Eric Pabo

Proceedings Volume 7362, 73620E (2009) https://doi.org/10.1117/12.821725

KEYWORDS: Wafer bonding, Polymers, Semiconducting wafers, Coating, Adhesives, Particles, Statistical analysis, Silicon, Standards development, Interfaces

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Proceedings Article | 12 February 2008 Paper

Waferbonded active/passive vertically coupled microring lasers

M. Hamacher, H. Heidrich, U. Troppenz, D. Syvridis, D. Alexandropoulos, S. Mikroulis, A. Kapsalis, C. W. Tee, K. Williams, V. Dragoi, M. Alexe, D. Cristea, M. Kusko

Proceedings Volume 6896, 68960R (2008) https://doi.org/10.1117/12.762507

KEYWORDS: Semiconducting wafers, Waveguides, Resonators, Wafer bonding, Microrings, Gallium arsenide, Laser bonding, Modulation, Optical alignment, Photomasks

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Proceedings Article | 15 May 2007 Paper

Plasma-activated wafer bonding: the new low-temperature tool for MEMS fabrication

V. Dragoi, G. Mittendorfer, C. Thanner, P. Lindner

Proceedings Volume 6589, 65890T (2007) https://doi.org/10.1117/12.721937

KEYWORDS: Wafer bonding, Semiconducting wafers, Plasma, Microelectromechanical systems, Oxides, Silicon, Annealing, Polymers, Manufacturing, Interfaces

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Proceedings Article | 24 February 2006 Paper

From magic to technology: materials integration by wafer bonding

Viorel Dragoi

Proceedings Volume 6123, 612314 (2006) https://doi.org/10.1117/12.646450

KEYWORDS: Wafer bonding, Semiconducting wafers, Optical alignment, Plasma, Annealing, Interfaces, Silicon, Glasses, Metals, Particles

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Proceedings Article | 1 July 2005 Paper

Plasma activated wafer bonding for MEMS

V. Dragoi, S. Farrens, P. Lindner

Proceedings Volume 5836, (2005) https://doi.org/10.1117/12.608788

KEYWORDS: Wafer bonding, Semiconducting wafers, Plasma, Annealing, Microelectromechanical systems, Silicon, Metals, Polymers, Chemistry, Ions

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Proceedings Article | 24 April 2003 Paper

Adhesive wafer bonding for MEMS applications

Viorel Dragoi, Thomas Glinsner, Gerald Mittendorfer, Bernhard Wieder, Paul Lindner

Proceedings Volume 5116, (2003) https://doi.org/10.1117/12.499077

KEYWORDS: Semiconducting wafers, Wafer bonding, Silicon, Annealing, Coating, Adhesives, Interfaces, Microelectromechanical systems, Glasses, Gallium arsenide

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Proceedings Article | 30 April 2001 Paper

Heterogeneous substrates for high-temperature and optical applications

Manfred Reiche, V. Dragoi, M. Alexe, Ulrich Goesele, Erich Thallner, Ch. Schaefer, F. Lindner

Proceedings Volume 4407, (2001) https://doi.org/10.1117/12.425327

KEYWORDS: Semiconducting wafers, Silicon, Wafer bonding, Interfaces, Gallium arsenide, Heterojunctions, Microelectromechanical systems, Wafer-level optics, Annealing, Diodes

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