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Dr. Trent Huang
at Zyvex Corp
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Author
Publications (1)
Proceedings Article | 16 January 2003 Paper
3D self-aligned microassembled electrical interconnects for heterogeneous integration
Trent Huang, Erik Nilsen, Matt Ellis, Kabseog Kim, Ken Tsui, George Skidmore, Chuck Goldsmith, Arunkumar Nallani, Jeong-Bong Lee
Proceedings Volume 4981, (2003) https://doi.org/10.1117/12.476319
KEYWORDS: Microelectromechanical systems, Connectors, Indium, Metals, Resistance, Gold, Directed self assembly, Robotic systems, Etching, Semiconducting wafers
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