Mr. Stefan T. Baur Profile

Stefan T. Baur

Director of Technology at RTX Corp

SPIE Involvement:

Author

Proceedings Article | 21 May 2011 Paper

Large format high-operability SWIR and MWIR focal plane array performance and capabilities

James Bangs, Mark Langell, Madhu Reddy, Leon Melkonian, Scott Johnson, Lee Elizondo, Kimon Rybnicek, Elyse Norton, Frank Jaworski, James Asbrock, Stefan Baur

Proceedings Volume 8012, 801234 (2011) https://doi.org/10.1117/12.887417

KEYWORDS: Semiconducting wafers, Sensors, Staring arrays, Mercury cadmium telluride, Detector arrays, Silicon, Mid-IR, Quantum efficiency, Readout integrated circuits, Infrared detectors

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High-performance large-format detector arrays responsive to the 1-5μm wavelength range of the infrared spectrum fabricated using large area HgCdTe layers grown on 6-inch diameter (211) silicon substrates are available for advanced imaging applications. This paper reviews performance and capabilities of Raytheon Vision Systems (RVS) HgCdTe/Si Focal Plane Arrays (FPA) and shows 2k x 2k format MWIR HgCdTe/Si FPA performance with NEdT operabilities better than 99.9%. SWIR and MWIR detector performance for HgCdTe/Si is comparable to established performance of HgCdTe/CdZnTe wafers. HgCdTe devices fabricated on both types of substrates have demonstrated very low dark current, high quantum efficiency and full spectral band fill factor characteristic of HgCdTe. HgCdTe has the advantage of being able to precisely tune the detector cutoff via adjustment of the Cd composition in the MBE growth. The HgCdTe/Si detectors described in this paper are p-on-n mesa delineated architecture and fabricated using the same mature etch, passivation, and metallization processes as our HgCdTe/CdZnTe line. Uniform device quality HgCdTe epitaxial layers and application of detector fabrication processes across the full area of 6-inch wafers routinely produces high performing detector pixels from edge to edge of the photolithographic limits across the wafer, offering 5 times the printable area as costly 6×6cm CdZnTe substrates. This 6-inch HgCdTe detector wafer technology can provide applications demanding very wide FOV high resolution coverage the capability to produce a very large single piece infrared detector array, up to a continuous image plane 10×10 cm in size. Alternatively, significant detector cost reduction through allowing more die of a given size to be printed on each wafer is possible, with further cost reduction achieved through transition towards automated detector fabrication and photolithographic processes for both increased yields and reduced touch labor costs. RVS continues to improve its FPA manufacturing line towards achieving low cost infrared FPAs with the format, size, affordability, and performance required for current and future infrared applications.

Proceedings Article | 15 May 2008 Paper

RVS uncooled sensor development for tactical applications

S. Black, M. Ray, C. Hewitt, R. Wyles, E. Gordon, K. Almada, S. Baur, M. Kuiken, D. Chi, T. Sessler

Proceedings Volume 6940, 694022 (2008) https://doi.org/10.1117/12.786615

KEYWORDS: Sensors, Staring arrays, Microbolometers, Cameras, Electronics, Thermography, Interfaces, Video, Readout integrated circuits, Nonuniformity corrections

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Proceedings Article | 14 May 2007 Paper

640 × 512 17 µm microbolometer FPA and sensor development

D. Murphy, M. Ray, J. Wyles, C. Hewitt, R. Wyles, E. Gordon, K. Almada, T. Sessler, S. Baur, D. Van Lue, S. Black

Proceedings Volume 6542, 65421Z (2007) https://doi.org/10.1117/12.724345

KEYWORDS: Sensors, Staring arrays, Microbolometers, Readout integrated circuits, Electronics, Thermography, Bolometers, Interfaces, Silicon, Power supplies

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Proceedings Article | 17 May 2006 Paper

High sensitivity 640 × 512 (20 μm pitch) microbolometer FPAs

D. Murphy, M. Ray, A. Kennedy, J. Wyles, C. Hewitt, R. Wyles, E. Gordon, T. Sessler, S. Baur, D. Van Lue, S. Anderson, R. Chin, H. Gonzalez, C. Le Pere, S. Ton

Proceedings Volume 6206, 62061A (2006) https://doi.org/10.1117/12.674018

KEYWORDS: Staring arrays, Sensors, Microbolometers, Electronics, Readout integrated circuits, Cameras, Nonuniformity corrections, Thermography, Resistance, Infrared imaging

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RVS has made a significant breakthrough in the development of a 640 × 512 array with a unit cell size of 20μm × 20 μm and performance equivalent to that of the 25μm arrays. The successful development of this array is the first step in achieving mega-pixel formats. This FPA is designed to ultimately achieve performance near the temperature fluctuation limited NETD (<20mK, f/1, 30 Hz). The SB-300 is a highly productized readout and is designed to achieve very good sensitivity (low NETD and low spatial noise) and good dynamic range. The improved performance is through bolometer structure improvements and an innovative ROIC design. It also has a simple and flexible electrical interface which allows external electronics to be small, light, low-cost, and low-power. Almost all adjustments can be made through the serial interface; hence there is no need for external adjustable (DAC) circuitry. The improved power supply rejection helps maintain highly stable detector and strip resistor bias voltages which helps reduce spatial noise and image artifacts. We will show updated performance and imagery on these arrays, which is currently being measured at <30mK, f/1,555 30 Hz. Pixel operability is greater than 99.5% on most FPAs, where the uncorrected responsivity nonuniformity is less than 4% (sigma/mean), and time constant for these arrays was measured at <8msec. We will report detailed FPA performance results including responsivity, noise, uniformity and pixel operability. We also plan to present video imagery from the most recent FPAs. The reduction in pixel size offers several potential benefits for IR systems. For a given system resolution (IFOV) requirement, the 20 μm pixel will allow an optical volume that is 50 % the size of a 25 μm based system! We will also provide an update on the enhanced performance and yield producibility of our NVESD ManTech 640 × 480 25 μm arrays, and also show data on 25 μm arrays that have been designed for faster time constants (5 ms), while maintaining high performance. We will also show the improvement in our uncooled 320 × 240 and 640 × 480 sensor electronics in terms of reduced power and size for helmet and rifle mounted sensors.

Proceedings Article | 31 May 2005 Paper

Expanded applications for high performance VOx microbolometer FPAs

D. Murphy, M. Ray, A. Kennedy, J. Wyles, C. Hewitt, R. Wyles, E. Gordon, T. Sessler, S. Baur, D. Van Lue, S. Anderson, R. Chin, H. Gonzalez, C. Le Pere, S. Ton, T. Kostrzewa

Proceedings Volume 5783, (2005) https://doi.org/10.1117/12.609462

KEYWORDS: Microbolometers, Staring arrays, Sensors, Readout integrated circuits, Thermography, Infrared imaging, Bolometers, Mid-IR, Resistance, Electronics

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Proceedings Article | 30 August 2004 Paper

Performance improvements for VOx microbolometer FPAs

Daniel Murphy, Michael Ray, Jessica Wyles, James Asbrock, C. Hewitt, Richard Wyles, Eli Gordon, T. Sessler, Adam Kennedy, Stefan Baur, David Van Lue, Steven Anderson, Richard Chin, H. Gonzales, C. Le Pere, S. Ton, Thomas Kostrzewa

Proceedings Volume 5406, (2004) https://doi.org/10.1117/12.548883

KEYWORDS: Microbolometers, Staring arrays, Sensors, Readout integrated circuits, Imaging systems, Electronics, Infrared imaging, Thermography, Resistance, Semiconducting wafers

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Proceedings Article | 8 December 2003 Paper

Two-color HgCdTe infrared staring focal plane arrays

Edward Smith, Le Pham, Gregory Venzor, Elyse Norton, Michael Newton, Paul Goetz, Valerie Randall, Gregory Pierce, Elizabeth Patten, Raymond Coussa, Ken Kosai, William Radford, John Edwards, Scott Johnson, Stefan Baur, John Roth, Brett Nosho, John Jensen, Randolph Longshore

Proceedings Volume 5209, (2003) https://doi.org/10.1117/12.507811

KEYWORDS: Staring arrays, Sensors, Mercury cadmium telluride, Long wavelength infrared, Infrared radiation, Mid-IR, Semiconducting wafers, Infrared detectors, Quantum efficiency, Etching

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Proceedings Article | 26 October 1998 Paper

Microbolometer uncooled infrared camera with 20-mK NETD

William Radford, Richard Wyles, Jessica Wyles, John Varesi, Michael Ray, Daniel Murphy, Adam Kennedy, A. Finch, Edgar Moody, F. Cheung, R. Coda, Stefan Baur

Proceedings Volume 3436, (1998) https://doi.org/10.1117/12.328064

KEYWORDS: Microbolometers, Staring arrays, Sensors, Cameras, Readout integrated circuits, Etching, Digital signal processing, Infrared imaging, Infrared sensors, Resistance

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Proceedings Article | 22 July 1998 Paper

Microbolometer uncooled infrared camera with 20-mK NETD

William Radford, Daniel Murphy, A. Finch, Adam Kennedy, J. Kojiro, Michael Ray, Richard Wyles, R. Coda, Edgar Moody, Stefan Baur

Proceedings Volume 3379, (1998) https://doi.org/10.1117/12.317595

KEYWORDS: Microbolometers, Staring arrays, Sensors, Cameras, Readout integrated circuits, Etching, Digital signal processing, Resistance, Infrared sensors, Silicon

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Proceedings Article | 17 June 1996 Paper

320x240 silicon microbolometer uncooled IR FPAs with on-chip offset correction

William Radford, Daniel Murphy, Michael Ray, Steven Propst, Adam Kennedy, J. Kojiro, James Woolaway, Kevin Soch, R. Coda, G. Lung, Edgar Moody, D. Gleichman, Stefan Baur

Proceedings Volume 2746, (1996) https://doi.org/10.1117/12.243062

KEYWORDS: Staring arrays, Microbolometers, Sensors, Silicon, Semiconducting wafers, Infrared imaging, Bolometers, Infrared radiation, Thermography, Infrared cameras

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Showing 5 of 10 publications

Conference Committee Involvement (11)

Infrared Technology and Applications XLIII

9 April 2017 | Anaheim, CA, United States

Infrared Technology and Applications XLII

18 April 2016 | Baltimore, MD, United States

Infrared Technology and Applications XLI

20 April 2015 | Baltimore, MD, United States

Infrared Technology and Applications XL

5 May 2014 | Baltimore, MD, United States

Infrared Technology and Applications XXXIX

29 April 2013 | Baltimore, Maryland, United States

Showing 5 of 11 Conference Committees

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