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Shi Zheng

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Proceedings Article | 4 March 2024 Paper

Icepak-based heat sink optimization design for automotive domain controllers

Tiecheng Wang, Lei Han, Jimin Ni, Shi Zheng

Proceedings Volume 12981, 129814E (2024) https://doi.org/10.1117/12.3015345

KEYWORDS: Heatsinks, Design, Field effect transistors, Device simulation, Mathematical optimization, Electronic components, Modeling

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With the development of automotive electronic and electrical architectures, domain controllers are also developing towards miniaturization and high integration, with the consequent increase in power density and intensification of heat dissipation problems. In this paper, a domain controller installed in the front compartment of a car is used to analyze the total heat production. The effect of different heat sink thickness and fin parameters on the heat dissipation of the heat sink was studied based on Icepak using a multi-parameter optimization method and the optimal combination of parameters was used for heat sink optimization. Thermal test results show that the maximum temperature of MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistor) is reduced by 9.6% and the average temperature is reduced by 8.5% after multi-parameter optimization. The heat sink mass is reduced by 7.6%. The heat sink can better meet the heat dissipation requirements. It proves the reliability of the optimized design method.

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