Dr. Liang Deng Profile

Dr. Liang Deng

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Publications (5)

Proceedings Article | 13 March 2009 Paper

Uniformity-aware standard cell design with accurate shape control

Hongbo Zhang, Martin Wong, Kai-Yuan Chao, Liang Deng, Soo-Han Choi

Proceedings Volume 7275, 72751G (2009) https://doi.org/10.1117/12.814445

KEYWORDS: Printing, Light sources, Double patterning technology, Standards development, Lithography, Metals, Resolution enhancement technologies, Manufacturing, Very large scale integration, Photomasks

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Proceedings Article | 4 March 2008 Paper

Manufacturing for design: a novel interconnect optimization method

Hongbo Zhang, Liang Deng, Kai-Yuan Chao, Martin Wong

Proceedings Volume 6925, 69250G (2008) https://doi.org/10.1117/12.772341

KEYWORDS: Manufacturing, Design for manufacturability, Optical proximity correction, Design for manufacturing, Capacitance, Resolution enhancement technologies, Photomasks, Process modeling, Tolerancing, Lithography

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Proceedings Article | 4 March 2008 Paper

Cell-based OPC with standard-cell fill insertion

Liang Deng, Kai-Yuan Chao, Hua Xiang, Martin Wong

Proceedings Volume 6925, 69251L (2008) https://doi.org/10.1117/12.773192

KEYWORDS: Optical proximity correction, Lithography, Photomasks, Standards development, Manufacturing, Resolution enhancement technologies, Metals, Model-based design, Lithographic illumination, Solids

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Proceedings Article | 21 March 2007 Paper

Boundary-based cellwise OPC for standard-cell layouts

David Pawlowski, Liang Deng, Martin Wong

Proceedings Volume 6521, 65211O (2007) https://doi.org/10.1117/12.712185

KEYWORDS: Optical proximity correction, Photomasks, Lithography, Standards development, Resolution enhancement technologies, Printing, Scattering, Model-based design, Lithographic illumination, Light sources

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Proceedings Article | 21 March 2007 Paper

Coupling-aware mixed dummy metal insertion for lithography

Liang Deng, Martin Wong, Kai-Yuan Chao, Hua Xiang

Proceedings Volume 6521, 65210H (2007) https://doi.org/10.1117/12.711644

KEYWORDS: Metals, Capacitance, Lithography, Optical proximity correction, Resolution enhancement technologies, Photomasks, SRAF, Manufacturing, Chemical mechanical planarization, Semiconducting wafers

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