Lerpong Jarupan
SPIE Involvement:
Author
Publications (3)

Proceedings Article | 8 December 2004 Paper
Proceedings Volume 5583, (2004) https://doi.org/10.1117/12.599992
KEYWORDS: Packaging, Fuzzy logic, Manufacturing, Genetic algorithms, Phase modulation, Genetics, Gallium, Solids, Product engineering, Liquid phase epitaxy

Proceedings Article | 4 March 2004 Paper
Proceedings Volume 5263, (2004) https://doi.org/10.1117/12.518434
KEYWORDS: Packaging, Picosecond phenomena, Manufacturing, Inspection, Virtual colonoscopy, Compact discs, Systems modeling, Cadmium, Voltage controlled voltage source, Time metrology

Proceedings Article | 27 February 2004 Paper
Proceedings Volume 5262, (2004) https://doi.org/10.1117/12.516151
KEYWORDS: Packaging, Manufacturing, Computer programming, Solids, Composites, Air contamination, Systems modeling, Water contamination, Environmental sensing, Product engineering

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