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Dr. Kevin E. Cooper
Dean, Advanced Technology at Indian River State College
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Publications (1)
Proceedings Article | 12 May 2005 Paper
Alignment robustness for 90 nm and 65 nm node through copper alignment mark integration optimization
Scott Warrick, Paul Hinnen, Rob Morton, Kevin Cooper, Pierre-Olivier Sassoulas, Jerome Depre, Ramon Navarro, Richard van Haren, Clyde Browning, Doug Reber, Henry Megens
Proceedings Volume 5754, (2005) https://doi.org/10.1117/12.599807
KEYWORDS: Optical alignment, Semiconducting wafers, Chemical mechanical planarization, Copper, Scanning probe microscopy, Front end of line, Back end of line, Overlay metrology, Metals, Silicon
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