The three-dimensional (3D) microstuructural evolution in a Pb-free solder system undergoing accelerated
electromigration (EM) testing is characterized using a custom, lab-scale, cone-beam, micro x-ray computed tomography
(μXCT) instrument. A micro-scale Sn-0.7Cu butt -joint was subjected to a current density of 104A/cm2 at 100°C. The
experimentation was enabled by the design of a miniature fixture for in situ imaging under accelerating EM testing
conditions. The fixture is friendly to surface imaging and μXCT scanning. The migrating species, copper and tin, are
observed volumetrically through substrate dissolution, solder build-up, and the formation of reaction products in the
solder joint by μXCT imaging. The migration of the copper substrate and the formation of copper-tin reaction products
is quantified.
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