Thermal characterization of three-dimensional printed components for light-emitting diode lighting system applications

Indika U. Perera; Nadarajah Narendran; Valeria Terentyeva

doi:10.1117/1.OE.57.4.041411

4 April 2018 Thermal characterization of three-dimensional printed components for light-emitting diode lighting system applications

Indika U. Perera, Nadarajah Narendran, Valeria Terentyeva

Author Affiliations +

Optical Engineering, Vol. 57, Issue 4, 041411 (April 2018). https://doi.org/10.1117/1.OE.57.4.041411

Abstract

This study investigated the thermal properties of three-dimensional (3-D) printed components with the potential to be used for thermal management in light-emitting diode (LED) applications. Commercially available filament materials with and without a metal filler were characterized with changes to the print orientation. 3-D printed components with an in-plane orientation had >30 % better effective thermal conductivity compared with components printed with a cross-plane orientation. A finite-element analysis was modeled to understand the effective thermal conductivity changes in the 3-D printed components. A simple thermal resistance model was used to estimate the required effective thermal conductivity of the 3-D printed components to be a viable alternative in LED thermal management applications.

Citation Download Citation

Indika U. Perera, Nadarajah Narendran, and Valeria Terentyeva "Thermal characterization of three-dimensional printed components for light-emitting diode lighting system applications," Optical Engineering 57(4), 041411 (4 April 2018). https://doi.org/10.1117/1.OE.57.4.041411

Received: 5 October 2017; Accepted: 13 March 2018; Published: 4 April 2018

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