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10 April 2024 300mm+ substrate UV/DUV low-cost, reliable periodic patterning solution for high-volume manufacturing
Kelsey Wooley, Harun Solak, Christian Dais, Francis Clube, Ahmed Mohammad, Iuliia Bykova, Thibault Seure, Mehdi Heydari, Matthew Wilson, Li Wang
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Proceedings Volume PC12956, Novel Patterning Technologies 2024; PC129560O (2024) https://doi.org/10.1117/12.3013328
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States
Abstract
In this presentation we share how the development of step-and-repeat DTL technology is addressing the growing need for periodic patterning in large-area device fabrication for display, AR/VR, and other photonic applications with low-cost, high-throughput (+40wph), high-resolution (UV, DUV) capabilities. Like projection lithography, non-contact, optical patterning is very repeatable and with a particle controlled mini-environment, robust to defectivity. Unlike projection, the DTL image is not limited to a small depth of focus (DOF). High resolution patterning is reliable over non-planar substrates and topography (300-400um), which is especially useful in applications where substrates are thick or so large that flatness is difficult to control. Other production–centric features include fully automated wafer and mask handling and high wafer throughput (+40wph). This technology shares the same material and process solutions that have been successfully used for semiconductor lithography for decades.
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Kelsey Wooley, Harun Solak, Christian Dais, Francis Clube, Ahmed Mohammad, Iuliia Bykova, Thibault Seure, Mehdi Heydari, Matthew Wilson, and Li Wang "300mm+ substrate UV/DUV low-cost, reliable periodic patterning solution for high-volume manufacturing", Proc. SPIE PC12956, Novel Patterning Technologies 2024, PC129560O (10 April 2024); https://doi.org/10.1117/12.3013328
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KEYWORDS
Optical lithography
Semiconducting wafers
High volume manufacturing
Lithography
Photomasks
Photonics
Deep ultraviolet
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