Presentation
9 March 2024 Characteristics of group III-nitride films prepared by pulsed sputtering
Author Affiliations +
Abstract
The basic characteristics of group-III nitride films prepared by pulsed sputtering have been investigated. We have found that films prepared by sputtering shows high electron and hole mobilities. We have also found that Heavily donor-doped GaN and AlGaN showed record low resistivity. and were successfully applied to various devices such as the source/drain of AlN/AlGaN HEMTs and tunnel contacts for optical devices.
Conference Presentation
© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hiroshi Fujioka and Kohei Ueno "Characteristics of group III-nitride films prepared by pulsed sputtering", Proc. SPIE PC12886, Gallium Nitride Materials and Devices XIX, PC1288603 (9 March 2024); https://doi.org/10.1117/12.3004962
Advertisement
Advertisement
KEYWORDS
Sputter deposition

Aluminum gallium nitride

Crystals

Field effect transistors

Gallium nitride

Optical components

RELATED CONTENT

Off axis sputter deposition of ZnO films on c sapphire...
Proceedings of SPIE (March 08 2014)
Thin films for neutron optics
Proceedings of SPIE (November 23 1992)
Improvement in the synthesis of Ni/Ti neutron mirrors
Proceedings of SPIE (November 23 1992)
Low frequency drain noise in AlGaN GaN HEMTs on Si...
Proceedings of SPIE (May 12 2003)

Back to Top