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Todays high reliability devices require photonic and optical components to be free from contaminants prior to final integratiuon into moduals. This is especially true for high power lasers, camera modules, etc. Often times multiple cleaning steps are needed on the part in order to remove debris left behind from it's carrier. Gel-Pak has studied various material and formfactor combinations that could possibly eliminate the need for these costly cleaning and inspection steps. This poster will present findings regarding a carrier that avoids contact with the active areas of optics and photonic devices.
(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Raj Varma
"High reliability devices require photonic and optical components to be free from contaminants prior to final assembly", Proc. SPIE PC12677, Astronomical Optics: Design, Manufacture, and Test of Space and Ground Systems IV, PC126770M (6 October 2023); https://doi.org/10.1117/12.2680648
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Raj Varma, "High reliability devices require photonic and optical components to be free from contaminants prior to final assembly," Proc. SPIE PC12677, Astronomical Optics: Design, Manufacture, and Test of Space and Ground Systems IV, PC126770M (6 October 2023); https://doi.org/10.1117/12.2680648