Process design kit and circuits at a 2 µm technology node for flexible wearable electronics applications
(Conference Presentation)

Miguel Torres-Miranda; Andreas Petritz; Herbert Gold; Barbara Stadlober

doi:10.1117/12.2236503

7 November 2016 Process design kit and circuits at a 2 µm technology node for flexible wearable electronics applications (Conference Presentation)

Miguel Torres-Miranda, Andreas Petritz, Herbert Gold, Barbara Stadlober

Author Affiliations +

Proceedings Volume 9945, Printed Memory and Circuits II; 99450D (2016) https://doi.org/10.1117/12.2236503
Event: SPIE Organic Photonics + Electronics, 2016, San Diego, California, United States

Abstract

In this work we present our most advanced technology node of organic thin film transistors (OTFTs) manufactured with a channel length as short as 2 μm by contact photolithography and a self-alignment process directly on a plastic substrate. Our process design kit (PDK) is described with P-type transistors, capacitors and 3 metal layers for connections of complex circuits. The OTFTs are composed of a double dielectric layer with a photopatternable ultra thin polymer (PNDPE) and alumina, with a thickness on the order of 100 nm. The organic semiconductor is either Pentacene or DNTT, which have a stable average mobility up to 0.1 cm2/Vs. Finally, a polymer (e.g.: Parylene-C) is used as a passivation layer. We describe also our design rules for the placement of standard circuit cells. A “plastic wafer” is fabricated containing 49 dies. Each die of 1 cm2 has between 25 to 50 devices, proving larger scale integration in such a small space, unique in organic technologies. Finally, we present the design (by simulations using a Spice model for OTFTs) and the test of analog and digital basic circuits: amplifiers with DC gains of about 20 dB, comparators, inverters and logic gates working in the frequency range of 1-10 kHz. These standard circuit cells could be used for signal conditioning and integrated as active matrices for flexible sensors from 3rd party institutions, thus opening our fab to new ideas and sophisticated pre-industrial low cost applications for the emerging fields of biomedical devices and wearable electronics for virtual/augmented reality.

Conference Presentation

Citation Download Citation

Miguel Torres-Miranda, Andreas Petritz, Herbert Gold, and Barbara Stadlober "Process design kit and circuits at a 2 µm technology node for flexible wearable electronics applications (Conference Presentation)", Proc. SPIE 9945, Printed Memory and Circuits II, 99450D (7 November 2016); https://doi.org/10.1117/12.2236503

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KEYWORDS

Electronics

Digital electronics

Polymers

Standards development

Transistors

Capacitors

Manufacturing

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