Thermal stress characterization using the impedance-based structural health monitoring system

Xuan Zhu; Francesco Lanza di Scalea; Mahmood Fateh

doi:10.1117/12.2218544

15 April 2016 Thermal stress characterization using the impedance-based structural health monitoring system

Xuan Zhu, Francesco Lanza di Scalea, Mahmood Fateh

Proceedings Volume 9799, Active and Passive Smart Structures and Integrated Systems 2016; 97990B (2016) https://doi.org/10.1117/12.2218544
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2016, Las Vegas, Nevada, United States

Abstract

Structural health monitoring (SHM) has attracted researchers’ interests for the past two decades to reinforce the maintenance of the aging infrastructure systems all over the world. As one of the potential solutions, the electro-mechanical impedance (EMI) method was introduced in the early 1990s and has a great number of potential applications in the SHM of civil, mechanical and aerospace industries. This paper studied the impedance-based technique with the presence of environmental/operational variability, especially the influences of temperature and uniaxial stress on the admittance signature-based features. A comprehensive analytical model is established and provides satisfactory agreements with the experimental results. The stress and temperature sensitivities of all the proposed features are quantified using the experimental measurements, with discussions on their advantages and disadvantages. The final results illustrate that the EMI method can potentially provide effective measure for thermal stress.

Conference Presentation

Citation Download Citation

Xuan Zhu, Francesco Lanza di Scalea, and Mahmood Fateh "Thermal stress characterization using the impedance-based structural health monitoring system", Proc. SPIE 9799, Active and Passive Smart Structures and Integrated Systems 2016, 97990B (15 April 2016); https://doi.org/10.1117/12.2218544

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