Helium ion beam lithography (HIBL) using HafSOx as the resist

Feixiang Luo; Viacheslav Manichev; Mengjun Li; Gavin Mitchson; Boris Yakshinskiy; Torgny Gustafsson; David Johnson; Eric Garfunkel

doi:10.1117/12.2219239

21 March 2016 Helium ion beam lithography (HIBL) using HafSOx as the resist

Feixiang Luo, Viacheslav Manichev, Mengjun Li, Gavin Mitchson, Boris Yakshinskiy, Torgny Gustafsson, David Johnson, Eric Garfunkel

Author Affiliations +

Proceedings Volume 9779, Advances in Patterning Materials and Processes XXXIII; 977928 (2016) https://doi.org/10.1117/12.2219239
Event: SPIE Advanced Lithography, 2016, San Jose, California, United States

Abstract

Helium ion beam lithography (HIBL) is a novel alternative lithographic technique with the capacity of fabricating highresolution and high-density features. Only limited research has been performed exploring HIBL to date. HafSOx (Hf(OH)_4–2x−2y(O2)_x(SO₄)_y·qH₂O) is a negative-tone inorganic resist that is one of several candidate resist materials for extreme ultraviolet lithography (EUVL) and e-beam lithography (EBL), and has been demonstrated to show high resolution, moderate sensitivity and low line-edge roughness (LER) in both EUVL and EBL. To date, no ion beam lithography work on HafSOx has been reported. In this study, we tested HafSOx as an HIBL resist and achieved a high sensitivity compared with EBL with a turn-on dose D₁₀₀ ~ 2-4 μC/cm². We obtained sub-10 nm line widths with low LER. A simple Monte Carlo simulation suggests that ionizing excitation accounts for most of the incident He ions’ energy loss.

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Feixiang Luo, Viacheslav Manichev, Mengjun Li, Gavin Mitchson, Boris Yakshinskiy, Torgny Gustafsson, David Johnson, and Eric Garfunkel "Helium ion beam lithography (HIBL) using HafSOx as the resist", Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 977928 (21 March 2016); https://doi.org/10.1117/12.2219239

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