Proposed approach to drive wafer topography for advanced lithography

John F. Valley; Andrey Melnikov; John A. Pitney

doi:10.1117/12.2214627

9 March 2016 Proposed approach to drive wafer topography for advanced lithography

John F. Valley, Andrey Melnikov, John A. Pitney

Proceedings Volume 9778, Metrology, Inspection, and Process Control for Microlithography XXX; 97783X (2016) https://doi.org/10.1117/12.2214627
Event: SPIE Advanced Lithography, 2016, San Jose, California, United States

Abstract

One requirement for advanced lithography remains suitable incoming wafer topography. We propose that local wafer flatness be visualized and quantified using the techniques developed for wafer front-surface nanotopography. This is a significant change in that existing wafer topography metrology tools do not enable our proposed approach.

Citation Download Citation

John F. Valley, Andrey Melnikov, and John A. Pitney "Proposed approach to drive wafer topography for advanced lithography", Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97783X (9 March 2016); https://doi.org/10.1117/12.2214627

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