Paper
25 October 2016 Thickness measurement of transparent film by white-light interferometry
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Abstract
White-light scanning interferometry plays an important role in precise profile metrology of microstructure. However, applying this approach may also be limited because of the optical reflection behavior of the surface. While there is a thin film on the surface, the reflection behavior of top and bottom of the thin-film will cause severer phase errors. Recently, the method by combining both reflectometry and white-light scanning interferometry is proposed to measure the film thickness and surface profile. This article firstly explains the principle of the proposed method and then verifies the feasibility of the thickness-measurement method for transparent film on a Silicon surface. Both of the algorithm and the experiment system have been optimized to measure the film thickness with high precision.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Qinyuan Deng, Yi Zhou, Junbo Liu, Jingwei Yao, and Song Hu "Thickness measurement of transparent film by white-light interferometry", Proc. SPIE 9685, 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems; and Smart Structures and Materials, 968506 (25 October 2016); https://doi.org/10.1117/12.2243601
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Cited by 1 scholarly publication.
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KEYWORDS
Thin films

Interferometry

Reflection

Silicon

Silicon films

Beam splitters

Optics manufacturing

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