As to minimize and eliminate the ESD damage in lithography process, we finally carry out the simplified recipe optimization solution which only need optimize for the develop rinse speed with different in-coming surface charge level and process application, so that can be easy implemented in the worldwide fabs. |
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Cited by 1 scholarly publication.
Semiconducting wafers
Metals
Corrosion
Lithography
Oxides
Plasma
Photoresist processing