Advances in three-dimensional integration technologies in support of infrared focal plane arrays

D. S. Temple; E. P. Vick; D. Malta; M. R. Lueck; M. R. Skokan; C. M. Masterjohn; M. S. Muzilla

doi:10.1117/12.2082877

8 February 2015 Advances in three-dimensional integration technologies in support of infrared focal plane arrays

D. S. Temple, E. P. Vick, D. Malta, M. R. Lueck, M. R. Skokan, C. M. Masterjohn, M. S. Muzilla

Proceedings Volume 9370, Quantum Sensing and Nanophotonic Devices XII; 93701L (2015) https://doi.org/10.1117/12.2082877
Event: SPIE OPTO, 2015, San Francisco, California, United States

Abstract

Staring infrared focal plane arrays (FPAs) require pixel-level, three-dimensional (3D) integration with silicon readout integrated circuits (ROICs) that provide detector bias, integrate detector current, and may further process the signals. There is an increased interest in ROIC technology as a result of two trends in the evolution of infrared FPAs. The first trend involves decreasing the FPA pixel size, which leads to the increased information content within the same FPA die size. The second trend involves the desire to enhance signal processing capability at the FPA level, which opens the door to the detector behaving like a smart peripheral rather than a passive component—with complex signal processing functions being executed on, rather than off, the FPA chip. In this paper, we review recent advances in 3D integration process technologies that support these key trends in the development of infrared FPAs. Specifically, we discuss approaches in which the infrared sensor is integrated with 3D ROIC stacks composed of multiple layers of silicon circuitry interconnected using metal-filled through-silicon vias. We describe the continued development of the 3D integration technology and summarize key demonstrations that show its viability for pixels as small as 5 microns.

Citation Download Citation

D. S. Temple, E. P. Vick, D. Malta, M. R. Lueck, M. R. Skokan, C. M. Masterjohn, and M. S. Muzilla "Advances in three-dimensional integration technologies in support of infrared focal plane arrays", Proc. SPIE 9370, Quantum Sensing and Nanophotonic Devices XII, 93701L (8 February 2015); https://doi.org/10.1117/12.2082877

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
7 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Readout integrated circuits

Staring arrays

Signal processing

Silicon

Analog electronics

Sensors

Infrared radiation

Show All Keywords

Keywords/Phrases

Search In:

Publication Years