Improved quality control of silicon wafers using novel off-line air pocket image analysis

John F. Valley; M. Cristina Sanna

doi:10.1117/12.2060227

27 August 2014 Improved quality control of silicon wafers using novel off-line air pocket image analysis

John F. Valley, M. Cristina Sanna

Proceedings Volume 9173, Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VIII; 91730A (2014) https://doi.org/10.1117/12.2060227
Event: SPIE NanoScience + Engineering, 2014, San Diego, California, United States

Abstract

Air pockets (APK) occur randomly in Czochralski (Cz) grown silicon (Si) crystals and may become included in wafers after slicing and polishing. Previously the only APK of interest were those that intersected the front surface of the wafer and therefore directly impacted device yield. However mobile and other electronics have placed new demands on wafers to be internally APK-free for reasons of thermal management and packaging yield. We present a novel, recently patented, APK image processing technique and demonstrate the use of that technique, off-line, to improve quality control during wafer manufacturing.

Citation Download Citation

John F. Valley and M. Cristina Sanna "Improved quality control of silicon wafers using novel off-line air pocket image analysis", Proc. SPIE 9173, Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VIII, 91730A (27 August 2014); https://doi.org/10.1117/12.2060227

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