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The CID Number appears on each page of the manuscript. The complete citation is used on the first page, and an abbreviated version on subsequent pages. Numbers in the index correspond to the last two digits of the six-digit CID Number. Conference CommitteeSymposium Chair
Symposium Co-chair
Conference Chair
Conference Co-chair
Conference Program Committee
Robert Allen, IBM Almaden Research Center (United States) Ramakrishnan Ayothi, JSR Micro, Inc. (United States) Luisa D. Bozano, IBM Almaden Research Center (United States) Sean D. Burns, IBM Corporation (United States) Ralph R. Dammel, AZ Electronic Materials USA Corporation (United States) Roel Gronheid, IMEC (Belgium) Douglas Guerrero, Brewer Science, Inc. (United States) Clifford L. Henderson, Georgia Institute of Technology (United States) Scott W. Jessen, Texas Instruments Inc. (United States) Yoshio Kawai, Shin-Etsu Chemical Co., Ltd. (Japan) Qinghuang Lin, IBM Thomas J. Watson Research Center (United States) Nobuyuki N. Matsuzawa, Sony Corporation (Japan) Dah-Chung Owe-Yang, Shin-Etsu MicroSi, Inc. (United States) Daniel P. Sanders, IBM Almaden Research Center (United States) Mark H. Somervell, Tokyo Electron America, Inc. (United States) James W. Thackeray, Dow Electronic Materials (United States) Plamen Tzviatkov, FUJIFILM Electronic Materials U.S.A., Inc. (United States) Todd R. Younkin, Intel Corporation (Belgium)
Session Chairs
1 Keynote Session Thomas I. Wallow, ASML US, Inc. (United States) Christoph K. Hohle, Fraunhofer Institute for Photonics Microsystems IPMS (Germany) 2 New EUV Resist Materials: Joint Session with Conferences 9048 and 9051 Robert L. Brainard, College of Nanoscale Science & Engineering, University at Albany (United States) James W. Thackeray, Dow Electronic Materials (United States) 3 Stochastics and EUV Process Improvements: Joint Session with Conferences 9048 and 9051 Roel Gronheid, IMEC (Belgium) Uzodinma Okoroanyanwu, GLOBALFOUNDRIES Inc. (Germany) 4 SEM Simulation and Emulation I: Joint Session with Conferences 9050 and 9051 Shunsuke Koshihara, Hitachi High-Technologies Corporation (Japan) Thomas I. Wallow, ASML US, Inc. (United States) 5 SEM Simulation and Emulation II: Joint Session with Conferences 9050 and 9051 Benjamin D. Bunday, SEMATECH Inc. (United States) Clifford L. Henderson, Georgia Institute of Technology (United States) 6 New Materials and Processes Robert Allen, IBM Almaden Research Center (United States) Ramakrishnan Ayothi, JSR Micro, Inc. (United States) 7 DSA Materials I Ralph R. Dammel, AZ Electronic Materials USA Corporation (United States) Douglas Guerrero, Brewer Science, Inc. (United States) 8 DSA Materials and Processes I: Joint Session with Conferences 9049 and 9051 Benjamen M. Rathsack, Tokyo Electron America, Inc. (United States) Roel Gronheid, IMEC (Belgium) 9 DSA Materials and Processes II: Joint Session with 9049 and 9051 James A. Liddle, National Institute of Standards and Technology (United States) Sean D. Burns, IBM Corporation (United States) 10 Materials and Process Fundamentals Todd R. Younkin, Intel Corporation (United States) Clifford L. Henderson, Georgia Institute of Technology (United States) 11 Advanced Patterning Processes Plamen Tzviatkov, FUJIFILM Electronic Materials U.S.A., Inc. (United States) Douglas Guerrero, Brewer Science, Inc. (United States) 12 DSA Materials II Mark H. Somervell, Tokyo Electron America, Inc. (United States) Daniel P. Sanders, IBM Almaden Research Center (United States) 13 Underlayers and Spin-on Materials Processing Robert Allen, IBM Almaden Research Center (United States) Christoph K. Hohle, Fraunhofer Institute for Photonic Microsystems IPMS (Germany) 14 EUV Materials Scott W. Jessen, Texas Instruments Inc. (United States) Thomas I. Wallow, ASML US, Inc. (United States)
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