Paper
7 December 2013 Optimizing the thermal budget for forming of nickel germanide on crystalline germanium
F. Algahtani, M. Blackford, E. Pirogova, A. S. Holland
Author Affiliations +
Proceedings Volume 8923, Micro/Nano Materials, Devices, and Systems; 89235A (2013) https://doi.org/10.1117/12.2034001
Event: SPIE Micro+Nano Materials, Devices, and Applications, 2013, Melbourne, Victoria, Australia
Abstract
Nickel germanide is used as a contact material in germanium devices for making low resistance electrical contacts. It forms at relatively low temperatures compared to other germanides. Metal thickness, reaction temperature and duration of temperature are critical parameters. Here we report on the minimum temperature of formation of nickel germanide and on the effect of duration of temperature. Nickel germanide forms rapidly at higher temperatures and more slowly at lower temperatures and below a critical temperature it does not form, for any duration.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
F. Algahtani, M. Blackford, E. Pirogova, and A. S. Holland "Optimizing the thermal budget for forming of nickel germanide on crystalline germanium", Proc. SPIE 8923, Micro/Nano Materials, Devices, and Systems, 89235A (7 December 2013); https://doi.org/10.1117/12.2034001
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KEYWORDS
Germanium

Nickel

Crystals

Silicon

Transmission electron microscopy

Diffraction

Resistance

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