Paper
29 March 2013 3D lithography for implant applications
Jens Schneider, Henning Feick, Dieter Kaiser, Marcel Heller, Daniel Sarlette
Author Affiliations +
Abstract
In this paper we describe an approach for the realization of 3D resist patterns for implant applications, highlighting the opportunities of controlling doping depth and profiles and their influence on device parameters. We choose a grayscale litho process, where the 3D structuring of the photoresist is done by a spatially variable exposure. Pixilated grayscale mask structures are defined to achieve the desired 3D resist patterns by locally variable transmittance values. The variable transmittance values result in different resist film thicknesses after development. Up to 20 different resist film thicknesses are obtained within a single exposure shot. This enables spatial patterning of the implant depth and accordingly various novel approaches for device optimization.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jens Schneider, Henning Feick, Dieter Kaiser, Marcel Heller, and Daniel Sarlette "3D lithography for implant applications", Proc. SPIE 8683, Optical Microlithography XXVI, 86831P (29 March 2013); https://doi.org/10.1117/12.2008444
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Cited by 1 scholarly publication.
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KEYWORDS
Photomasks

Grayscale lithography

Doping

Lithography

Silicon

Ion implantation

Photoresist processing

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