2D capacitive micromachined ultrasound transducer using novel tiling based on silicon frame

Youngil Kim; Kyungil Cho; Baehyung Kim; Seungheun Lee; Taeho Jeon; Jongkeun Song

doi:10.1117/12.2006140

29 March 2013 2D capacitive micromachined ultrasound transducer using novel tiling based on silicon frame

Youngil Kim, Kyungil Cho, Baehyung Kim, Seungheun Lee, Taeho Jeon, Jongkeun Song

Proceedings Volume 8675, Medical Imaging 2013: Ultrasonic Imaging, Tomography, and Therapy; 86750E (2013) https://doi.org/10.1117/12.2006140
Event: SPIE Medical Imaging, 2013, Lake Buena Vista (Orlando Area), Florida, United States

Abstract

In this study, we showed the new transducer and probe integration of 2D ultrasound probe using cMUT. cMUT ultrasound probe having 8192 elements is assembled with tiling frame. Flip chip bonded cMUT-ASIC tiles were arrayed along 2×8 directions to enlarge lateral aperture. Tiling gap between two tiles was under 100μm. RTV layer that has 1mm thick is used in 2-D probe system as a lens and protection layer. Thermal module is also analyzed by using the thermal network analysis, which is realized with the air fans and the fins. Designed PCB circuit for tiling module which is considered with cooling spread concept is 5cm × 5cm dimension. Uniformity and performance of tiled ultrasound transducer were tested under soybean oil at 3MHz frequency successfully. The measured 256 elements distribution has only 4.45% deviation. If we can remove the side edge error, the deviation will be under 3%. The performance after RTV lensing showed 35% attenuation in Tx and 35~45% attenuation in Rx.

Citation Download Citation

Youngil Kim, Kyungil Cho, Baehyung Kim, Seungheun Lee, Taeho Jeon, and Jongkeun Song "2D capacitive micromachined ultrasound transducer using novel tiling based on silicon frame", Proc. SPIE 8675, Medical Imaging 2013: Ultrasonic Imaging, Tomography, and Therapy, 86750E (29 March 2013); https://doi.org/10.1117/12.2006140

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