Paper
26 February 2013 Segmentation of materials images using 3D electron interaction modeling
Dae Woo Kim, Mary L. Comer
Author Affiliations +
Proceedings Volume 8657, Computational Imaging XI; 86570G (2013) https://doi.org/10.1117/12.2012829
Event: IS&T/SPIE Electronic Imaging, 2013, Burlingame, California, United States
Abstract
In this paper, we propose the scanning electron microscope (SEM) image blurring model and apply this model to the joint deconvolution and segmentation method which performs deconvolution and segmentation simultaneously. In the field of materials science and engineering, automated image segmentation techniques are critical and getting exact boundary shape is especially important. However, there are still some difficulty in getting good segmentation results when the images have blurring degradation. SEM images have blurring due in part to complex electron interactions during acquisition. To improve segmentation results at object boundaries, we incorporate prior knowledge of this blurring degradation into the existing EM/MPM segmentation algorithm. Experimental results are presented to demonstrate that the proposed method can be used to improve the segmentation of microscope images of materials.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dae Woo Kim and Mary L. Comer "Segmentation of materials images using 3D electron interaction modeling", Proc. SPIE 8657, Computational Imaging XI, 86570G (26 February 2013); https://doi.org/10.1117/12.2012829
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KEYWORDS
Image segmentation

3D modeling

Scanning electron microscopy

Image processing algorithms and systems

Expectation maximization algorithms

3D image processing

Deconvolution

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