Progress and challenges in industrial fabrication of wafer-fused VCSELs emitting in the 1310 nm band for high-speed wavelength division multiplexing applications

V. Iakovlev; A. Sirbu; Z. Micković; D. Ellafi; G. Suruceanu; A. Mereuta; A. Caliman; E. Kapon

doi:10.1117/12.2003759

13 March 2013 Progress and challenges in industrial fabrication of wafer-fused VCSELs emitting in the 1310 nm band for high-speed wavelength division multiplexing applications

V. Iakovlev, A. Sirbu, Z. Micković, D. Ellafi, G. Suruceanu, A. Mereuta, A. Caliman, E. Kapon

Author Affiliations +

Proceedings Volume 8639, Vertical-Cavity Surface-Emitting Lasers XVII; 863904 (2013) https://doi.org/10.1117/12.2003759
Event: SPIE OPTO, 2013, San Francisco, California, United States

Abstract

Building coarse wavelength division multiplexing (WDM), 4×10 Gbps VCSEL transmitter modules has the promise for dramatic decreasing power consumption. Over the last years, we have demonstrated continuous improvements of parameters and reliability of wafer fused long-wavelength VCSELs. Progress and challenges in industrial fabrication of wafer-fused VCSELs emitting in the 1310 nm band for high speed WDM applications are reviewed.

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V. Iakovlev, A. Sirbu, Z. Micković, D. Ellafi, G. Suruceanu, A. Mereuta, A. Caliman, and E. Kapon "Progress and challenges in industrial fabrication of wafer-fused VCSELs emitting in the 1310 nm band for high-speed wavelength division multiplexing applications", Proc. SPIE 8639, Vertical-Cavity Surface-Emitting Lasers XVII, 863904 (13 March 2013); https://doi.org/10.1117/12.2003759

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