Vertically integrated double-layer on-chip crystalline silicon nanomembranes based on adhesive bonding

Yang Zhang; David Kwong; Xiaochuan Xu; Amir Hosseini; Sang Y. Yang; John A. Rogers; Ray T. Chen

doi:10.1117/12.2005440

27 February 2013 Vertically integrated double-layer on-chip crystalline silicon nanomembranes based on adhesive bonding

Yang Zhang, David Kwong, Xiaochuan Xu, Amir Hosseini, Sang Y. Yang, John A. Rogers, Ray T. Chen

Proceedings Volume 8630, Optoelectronic Interconnects XIII; 863019 (2013) https://doi.org/10.1117/12.2005440
Event: SPIE OPTO, 2013, San Francisco, California, United States

Abstract

In this paper we demonstrate a three-dimensional (3D) photonic integration scheme based on crystalline silicon. We develop a process using SU-8 based adhesive bonding to fabricate vertically stacked, double-layer silicon nanomembranes. A single-layer silicon photonic integrated circuit fabricated on a silicon-on-insulator (SOI) chip and a bare SOI chip are bonded together, followed by removal of the bare SOI chip’s silicon substrate and buried oxide layer, to form a silicon nanomembrane as a platform for additional photonic layer. We designed and fabricated subwavelength nanostructure based fiber-to-chip grating coupler on the bonded silicon nanomembrane, and also inter-layer grating coupler for coupling between two silicon nanomembranes. The fiber-to-chip grating coupler has a peak efficiency of -3.9 dB at 1545 nm operating wavelength with transverse-electric (TE) polarization. The inter-layer grating coupler has a peak efficiency of -6.8 dB at 1533 nm operating wavelength with TE polarization. The demonstrated approach serves as a potential solution for 3D photonic integration and novel 3D photonic devices.

Citation Download Citation

Yang Zhang, David Kwong, Xiaochuan Xu, Amir Hosseini, Sang Y. Yang, John A. Rogers, and Ray T. Chen "Vertically integrated double-layer on-chip crystalline silicon nanomembranes based on adhesive bonding", Proc. SPIE 8630, Optoelectronic Interconnects XIII, 863019 (27 February 2013); https://doi.org/10.1117/12.2005440

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