Paper
31 May 2012 Development of microbolometer with high fill factor and high mechanical stability by shared-anchor structure
Taehyun Kim, Kimyung Kyung, Jae Hong Park, Young Su Kim, Sung Kyu Lim, Kyungmin Kim, Kwyro Lee, C. Welham, Hee Yeoun Kim
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Abstract
For the development of small microbolometer for mobile applications, new pixel design to enhance fill factor by sharedanchor structures is suggested and it can be possible to make a one anchor per unit pixel. Fill factor increases 10% more than that of normal unshared-anchor design. Amorphous-silicon based microbolometer has been fabricated with 64x64 arrays of 25um pixel size to verify proposed design. Mechanical flatness of shared-anchor structure is enhanced. Responsivity is enhanced from 1.08e+5 V/W to 1.23e+5 V/W due to the increase of fill-factor compared to unsharedanchor. There are no mechanical, electrical and thermal crosstalk problems with adjacent pixels.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Taehyun Kim, Kimyung Kyung, Jae Hong Park, Young Su Kim, Sung Kyu Lim, Kyungmin Kim, Kwyro Lee, C. Welham, and Hee Yeoun Kim "Development of microbolometer with high fill factor and high mechanical stability by shared-anchor structure", Proc. SPIE 8353, Infrared Technology and Applications XXXVIII, 83531B (31 May 2012); https://doi.org/10.1117/12.918916
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CITATIONS
Cited by 7 scholarly publications.
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KEYWORDS
Microbolometers

Readout integrated circuits

Resistance

Sensors

Thermography

Capacitance

Materials processing

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