Novel coupling and packaging approaches for optical interconnects

B. Van Hoe; E. Bosman; J. Missinne; S. Kalathimekkad; G. Van Steenberge; P. Van Daele

doi:10.1117/12.913760

2 February 2012 Novel coupling and packaging approaches for optical interconnects

B. Van Hoe, E. Bosman, J. Missinne, S. Kalathimekkad, G. Van Steenberge, P. Van Daele

Proceedings Volume 8267, Optoelectronic Interconnects XII; 82670T (2012) https://doi.org/10.1117/12.913760
Event: SPIE OPTO, 2012, San Francisco, California, United States

Abstract

We present the design and fabrication of a complete optical interconnection scheme including the optoelectronic package, containing driving Vertical Cavity Surface Emitting Lasers (VCSELs) and read-out photodiode (PDs), the coupling scheme of the fiber or waveguide interconnect and the fabrication technology of the waveguide structures itself. Both the optoelectronic package and the waveguide part are fabricated using polymer materials resulting in a low-cost, flexible interconnection scheme. The optoelectronic package consists of an ultra-thin (20 μm) chip embedded in a flexible polymer stack, connected through metalized microvias using thin film deposition steps. A 45° deflecting micromirror is used to couple this optoelectronic package to an optical fiber or an optical waveguide. The waveguiding structures can be integrated with the coupling plug leading to a 1 step alignment process which significantly reduces the coupling losses. Flexible and stretchable multimode polymer waveguides are also developed to end up with a fully flexible optical interconnect for short (waveguide) or long distance (fiber) communication or for application in sensing.

Citation Download Citation

B. Van Hoe, E. Bosman, J. Missinne, S. Kalathimekkad, G. Van Steenberge, and P. Van Daele "Novel coupling and packaging approaches for optical interconnects", Proc. SPIE 8267, Optoelectronic Interconnects XII, 82670T (2 February 2012); https://doi.org/10.1117/12.913760

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