Design of a highly parallel board-level-interconnection with 320 Gbps capacity

U. Lohmann; J. Jahns; S. Limmer; D. Fey; H. Bauer

doi:10.1117/12.905888

2 February 2012 Design of a highly parallel board-level-interconnection with 320 Gbps capacity

U. Lohmann, J. Jahns, S. Limmer, D. Fey, H. Bauer

Proceedings Volume 8267, Optoelectronic Interconnects XII; 826706 (2012) https://doi.org/10.1117/12.905888
Event: SPIE OPTO, 2012, San Francisco, California, United States

Abstract

A parallel board-level interconnection design is presented consisting of 32 channels, each operating at 10 Gbps. The hardware uses available optoelectronic components (VCSEL, TIA, pin-diodes) and a combination of planarintegrated free-space optics, fiber-bundles and available MEMS-components, like the DMD™ from Texas Instruments. As a specific feature, we present a new modular inter-board interconnect, realized by 3D fiber-matrix connectors. The performance of the interconnect is evaluated with regard to optical properties and power consumption. Finally, we discuss the application of the interconnect for strongly distributed system architectures, as, for example, in high performance embedded computing systems and data centers.

Citation Download Citation

U. Lohmann, J. Jahns, S. Limmer, D. Fey, and H. Bauer "Design of a highly parallel board-level-interconnection with 320 Gbps capacity", Proc. SPIE 8267, Optoelectronic Interconnects XII, 826706 (2 February 2012); https://doi.org/10.1117/12.905888

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