Addressing 3D metrology challenges by using a multiple detector CDSEM

Mitsuo Hiroyama; Tsutomu Murakawa; Masayuki Kuribara; Toshimichi Iwai; Minoru Soma; Ikuo Iko; Masahiro Seyama; Jun Matsumoto; Takayuki Nakamura; Hidemitsu Hakii; Isao Yonekura; Masashi Kawashita; Yasushi Nishiyama; Keishi Tanaka; Kenji Komoto

doi:10.1117/12.896982

13 October 2011 Addressing 3D metrology challenges by using a multiple detector CDSEM

Mitsuo Hiroyama, Tsutomu Murakawa, Masayuki Kuribara, Toshimichi Iwai, Minoru Soma, Ikuo Iko, Masahiro Seyama, Jun Matsumoto, Takayuki Nakamura, Hidemitsu Hakii, Isao Yonekura, Masashi Kawashita, Yasushi Nishiyama, Keishi Tanaka, Kenji Komoto

Author Affiliations +

Proceedings Volume 8166, Photomask Technology 2011; 81661R (2011) https://doi.org/10.1117/12.896982
Event: SPIE Photomask Technology, 2011, Monterey, California, United States

Abstract

In next generation lithography (NGL) for the 22nm node and beyond, the three dimensional (3D) shape measurements of side wall angle (SWA) and height of the photomask pattern will become critical for controlling the exposure characteristics and wafer printability. Until today, cross-section SEM (X-SEM) and Atomic Force Microscope (AFM) methods are used to make 3D measurements, however, these techniques require time consuming preparation and observation. This paper presents an innovative technology for 3D measurement using a multiple detector CDSEM and reports its accuracy and precision.

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Mitsuo Hiroyama, Tsutomu Murakawa, Masayuki Kuribara, Toshimichi Iwai, Minoru Soma, Ikuo Iko, Masahiro Seyama, Jun Matsumoto, Takayuki Nakamura, Hidemitsu Hakii, Isao Yonekura, Masashi Kawashita, Yasushi Nishiyama, Keishi Tanaka, and Kenji Komoto "Addressing 3D metrology challenges by using a multiple detector CDSEM", Proc. SPIE 8166, Photomask Technology 2011, 81661R (13 October 2011); https://doi.org/10.1117/12.896982

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