Shape and thickness measurements using a reconstruction method for linear sensor microscopy based on improvement of lateral resolution isotropy

M. P. Macedo; C. M. B. A. Correia

doi:10.1117/12.889408

27 May 2011 Shape and thickness measurements using a reconstruction method for linear sensor microscopy based on improvement of lateral resolution isotropy

M. P. Macedo, C. M. B. A. Correia

Author Affiliations +

Proceedings Volume 8082, Optical Measurement Systems for Industrial Inspection VII; 808236 (2011) https://doi.org/10.1117/12.889408
Event: SPIE Optical Metrology, 2011, Munich, Germany

Abstract

Linear sensor microscopy as a mode of slit microscopy is faster than confocal microscopy as it eliminates one lateral scanning but its lateral/axial resolution are lower. Regardless specific image formation characteristics dependent on illumination mode its circular symmetry is lost therefore lateral resolution anisotropy arises. The purpose of this work is to evaluate the application of a low-cost scanning-stage bench-microscope in brightfield reflection mode using a linear sensor for shape and thickness measurements. Firstly we describe overall system architecture emphasizing its effectiveness to easily accommodate different optical setups. In particular different configurations of scanning microscopes are briefly described and a comparison of its image formation characteristics is presented giving special attention to the effect of slit illumination/detection. Results of lateral resolution in both lateral orientations show slit illumination should be used. A reconstruction method used to build three-dimensional representations from images of 3D structures results in relief borders shapes equally defined independently of its orientation relative to sensor. Further results of its application for the measurement of height and thickness of PCB tracks show its inherent ability though a more robust reconstruction algorithm integrating data from light distribution in sensor is being developed to improve clearness and measurement accuracy.

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M. P. Macedo and C. M. B. A. Correia "Shape and thickness measurements using a reconstruction method for linear sensor microscopy based on improvement of lateral resolution isotropy", Proc. SPIE 8082, Optical Measurement Systems for Industrial Inspection VII, 808236 (27 May 2011); https://doi.org/10.1117/12.889408

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KEYWORDS

Sensors

3D metrology

3D image processing

Confocal microscopy

Microscopes

Microscopy

Algorithm development

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