Mask registration impact on intrafield on-wafer overlay performance

Guo-Tsai Huang; Alex Chen; Tung-Yaw Kang; S. C. Lee; Frank Laske; Klaus-Dieter Roethe; DongSub Choi; Chiang Reinhart; John C. Robinson; You Seung Jin; Lin Chua; David Tien; Venkat R. Nagaswami

doi:10.1117/12.879485

28 March 2011 Mask registration impact on intrafield on-wafer overlay performance

Guo-Tsai Huang, Alex Chen, Tung-Yaw Kang, S. C. Lee, Frank Laske, Klaus-Dieter Roethe, DongSub Choi, Chiang Reinhart, John C. Robinson, You Seung Jin, Lin Chua, David Tien, Venkat R. Nagaswami

Author Affiliations +

Proceedings Volume 7971, Metrology, Inspection, and Process Control for Microlithography XXV; 797106 (2011) https://doi.org/10.1117/12.879485
Event: SPIE Advanced Lithography, 2011, San Jose, California, United States

Abstract

Improved overlay performance is one of the critical elements in enabling the continuing advancement of the semiconductor integrated circuit (IC) industry. With each advancing process node, additional sources of overlay error and new methods of reducing those errors need to be taken into account. We consider the impact of mask registration or pattern placement errors on intra-field on-wafer overlay performance. Mask registration data is typically minimally sampled and not well incorporated into the wafer fab overlay systems. In this work we consider mask-to-mask overlay and point out the importance of high density sampling as well as the potential for improved mask qualification and disposition.

Citation Download Citation

Guo-Tsai Huang, Alex Chen, Tung-Yaw Kang, S. C. Lee, Frank Laske, Klaus-Dieter Roethe, DongSub Choi, Chiang Reinhart, John C. Robinson, You Seung Jin, Lin Chua, David Tien, and Venkat R. Nagaswami "Mask registration impact on intrafield on-wafer overlay performance", Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 797106 (28 March 2011); https://doi.org/10.1117/12.879485

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