Paper
8 April 2011 Photoresist shrinkage effects at EUV
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Abstract
Volumetric mechanical resist shrinkage is shown to cause pattern distortions and profile footing. The shrinkage-induced pattern distortions include corner rounding effects and are essentially the explanation for the corner rounding bias previously observed by Anderson et al.[1]. Two previously-studied mechanisms for resist shrinkage are described: SEM-induced shrinkage and deprotection-induced shrinkage. A third mechanism, shrinkage induced at post-apply bake is also described. Experiments indicate that SEM-induced shrinkage accounts for the vast majority of shrinkage and pattern distortion while deprotection-induced shrinkage, although present, does not contribute significantly to pattern distortion. Shrinkage due to post-apply bake was not observed and thought to be insignificant. A three-dimensional model for shrinkage, based on the standard elastostatic problem in solid mechanics was implemented into a lithography simulator. The model was able to predict two dimensional pattern distortions similar to those observed experimentally.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas V. Pistor, Thomas I. Wallow, Christopher N. Anderson, and Patrick P. Naulleau "Photoresist shrinkage effects at EUV", Proc. SPIE 7969, Extreme Ultraviolet (EUV) Lithography II, 796917 (8 April 2011); https://doi.org/10.1117/12.879554
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Cited by 6 scholarly publications and 1 patent.
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KEYWORDS
Distortion

Extreme ultraviolet lithography

3D modeling

Photoresist materials

Extreme ultraviolet

Lithography

Silicon

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