Packaging technology enabling flexible optical interconnections

Erwin Bosman; Geert Van Steenberge; Jeroen Missinne; Bram Van Hoe; Sandeep Kalathimekkad; Peter Van Daele

doi:10.1117/12.874959

17 January 2011 Packaging technology enabling flexible optical interconnections

Erwin Bosman, Geert Van Steenberge, Jeroen Missinne, Bram Van Hoe, Sandeep Kalathimekkad, Peter Van Daele

Proceedings Volume 7944, Optoelectronic Interconnects and Component Integration XI; 79440E (2011) https://doi.org/10.1117/12.874959
Event: SPIE OPTO, 2011, San Francisco, California, United States

Abstract

This paper reports on the latest trends and results on the integration of optical and opto-electronic devices and interconnections inside flexible carrier materials. Electrical circuits on flexible substrates are a very fast growing segment in electronics, but opto-electronics and optics should be able to follow these upcoming trends. This paper presents the back-thinning and packaging of single opto-electronic devices resulting in highly flexible and reliable packages. Optical waveguides and optical out-of-plane coupling structures are integrated inside the same layer stack, resulting in complete VCSEL-to-PD links with low total optical losses and high resistance to heat cycling and moisture exposure.

Citation Download Citation

Erwin Bosman, Geert Van Steenberge, Jeroen Missinne, Bram Van Hoe, Sandeep Kalathimekkad, and Peter Van Daele "Packaging technology enabling flexible optical interconnections", Proc. SPIE 7944, Optoelectronic Interconnects and Component Integration XI, 79440E (17 January 2011); https://doi.org/10.1117/12.874959

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