Paper
30 March 2010 Productivity improvement in the wafer bevel and backside cleaning before exposure
Yoichi Tokunaga, Shuuichi Nishikido, Kousuke Yoshihara, Zoe Hong, Marlene Strobl, Yu Chen Lin
Author Affiliations +
Abstract
The Back-side Surface Treatment ("BST") is a module that cleans the backside of a wafer just before a process on the exposure system. To support immersion lithography, Tokyo Electron introduces a bevel cleaning function to this module. This enables cleaning of both wafer backside and bevel section at the same time. We evaluate the new BST module for wafer cleaning performance, wafer backside cleaning performance and wafer topside particle control performance. The effectiveness of the BST module is tested in an actual production line. It is proved that the introduction of the BST module reduces defocus and blocked images.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yoichi Tokunaga, Shuuichi Nishikido, Kousuke Yoshihara, Zoe Hong, Marlene Strobl, and Yu Chen Lin "Productivity improvement in the wafer bevel and backside cleaning before exposure", Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 763924 (30 March 2010); https://doi.org/10.1117/12.846488
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KEYWORDS
Semiconducting wafers

Particles

Photoresist processing

Contamination

Image processing

Coating

Immersion lithography

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