Nikon EUVL development progress update

Takaharu Miura; Katsuhiko Murakami; Hidemi Kawai; Yoshiaki Kohama; Kenji Morita; Kazunari Hada; Yukiharu Ohkubo

doi:10.1117/12.846459

20 March 2010 Nikon EUVL development progress update

Takaharu Miura, Katsuhiko Murakami, Hidemi Kawai, Yoshiaki Kohama, Kenji Morita, Kazunari Hada, Yukiharu Ohkubo

Proceedings Volume 7636, Extreme Ultraviolet (EUV) Lithography; 76361G (2010) https://doi.org/10.1117/12.846459
Event: SPIE Advanced Lithography, 2010, San Jose, California, United States

Abstract

Nikon has been developing the full field exposure tool called EUV1 for process development of 32nm hp node and beyond. The unique feature of EUV1 is the capability of variable illumination coherence and off-axis illumination. EUV1 was installed in Selete and used for EUV lithography process development. Nikon also has conducted continuous collaborative works with customers using EUV1. Since the last SPIE Symposium in 2009, many exposure results with EUV1 tools were obtained. They showed excellent resolution capability beyond 24nm L/S with off-axis illumination and stable overlay capability of 10nm (Mean + 3 sigma). Process development exposures of test chip patterns are ongoing. With regard to HVM tool development, imaging capability with high NA projection optics and throughput capability are reviewed.

Citation Download Citation

Takaharu Miura, Katsuhiko Murakami, Hidemi Kawai, Yoshiaki Kohama, Kenji Morita, Kazunari Hada, and Yukiharu Ohkubo "Nikon EUVL development progress update", Proc. SPIE 7636, Extreme Ultraviolet (EUV) Lithography, 76361G (20 March 2010); https://doi.org/10.1117/12.846459

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