Thermal stress reduction of bilayered systems by means of linearly graded interlayer

Binglian Wang; Yizeng Li; Yongzhong Huo

doi:10.1117/12.841931

20 October 2009 Thermal stress reduction of bilayered systems by means of linearly graded interlayer

Binglian Wang, Yizeng Li, Yongzhong Huo

Proceedings Volume 7493, Second International Conference on Smart Materials and Nanotechnology in Engineering; 749348 (2009) https://doi.org/10.1117/12.841931
Event: Second International Conference on Smart Materials and Nanotechnology in Engineering, 2009, Weihai, China

Abstract

The technique of introducing graded interlayers has been used extensively to mitigate residual thermal stresses in joining dissimilar materials. The case-to-case numerical methods have often been used to discuss the effectiveness of the graded interlayers, because it is always a mathematical difficulty in analytical analysis. In this work, thermal stress reduction of bilayered systems with linearly graded interlayer is considered with analytical approaches. It has been found that the maximal stress in the system will always be lowered with a thick enough interlayer. However, if the interlayer thickness is restricted, a critical range of the elastic modulus and layer thicknesses of the original bilayered system can be identified only in which the maximal stress can be reduced. An even smaller range is found within which the maximal stress always decreases with the increase of the interlayer thickness.

Citation Download Citation

Binglian Wang, Yizeng Li, and Yongzhong Huo "Thermal stress reduction of bilayered systems by means of linearly graded interlayer", Proc. SPIE 7493, Second International Conference on Smart Materials and Nanotechnology in Engineering, 749348 (20 October 2009); https://doi.org/10.1117/12.841931

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