Laser Soldering Of Surface Mounted Devices

Friedrich G. Meyer; Bernhard H. Klimt

doi:10.1117/12.966958

1 January 1987 Laser Soldering Of Surface Mounted Devices

Friedrich G. Meyer, Bernhard H. Klimt

Proceedings Volume 0744, Lasers in Motion for Industrial Applications; (1987) https://doi.org/10.1117/12.966958
Event: OE LASE'87 and EO Imaging Symposium, 1987, Los Angeles, CA, United States

Abstract

Advantages and construction principles of laser soldering systems are discussed. First results with a production type Y AG laser system soldering SMD components are presented: Small and fine grain intermetallic zones, high mechanical strength, component size up to 40 x 40 mm², soldering speed 28 pads per second.

Citation Download Citation

Friedrich G. Meyer and Bernhard H. Klimt "Laser Soldering Of Surface Mounted Devices", Proc. SPIE 0744, Lasers in Motion for Industrial Applications, (1 January 1987); https://doi.org/10.1117/12.966958

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