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As we approach the 22nm half-pitch (hp) technology node, the industry is rapidly running out of patterning options. Of
the several lithography techniques highlighted in the International Technology Roadmap for Semiconductors (ITRS), the
leading contender for the 22nm hp insertion is extreme ultraviolet lithography (EUVL). Despite recent advances with
EUV resist and improvements in source power, achieving defect free EUV mask blank and enabling the EUV mask
infrastructure still remain critical issues. To meet the desired EUV high volume manufacturing (HVM) insertion target
date of 2013, these obstacles must be resolved on a timely bases. Many of the EUV mask related challenges remain in
the pre-competitive stage and a collaborative industry based consortia, such as SEMATECH can play an important role
to enable the EUVL landscape. SEMATECH based in Albany, NY is an international consortium representing several of
the largest manufacturers in the semiconductor market. Full members include Intel, Samsung, AMD, IBM, Panasonic,
HP, TI, UMC, CNSE (College of Nanoscience and Engineering), and Fuller Road Management. Within the
SEMATECH lithography division a major thrust is centered on enabling the EUVL ecosystem from mask development,
EUV resist development and addressing EUV manufacturability concerns. An important area of focus for the
SEMATECH mask program has been the Mask Blank Development Center (MBDC). At the MBDC key issues in EUV
blank development such as defect reduction and inspection capabilities are actively pursued together with research
partners, key suppliers and member companies. In addition the mask program continues a successful track record of
working with the mask community to manage and fund critical mask tools programs. This paper will highlight recent
status of mask projects and longer term strategic direction at the MBDC. It is important that mask technology be ready to
support pilot line development HVM by 2013. In several areas progress has been made but a continued collaborative
effort will be needed along with timely infrastructure investments to meet these challenging goals.
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